About The Author

Hooman Javdan

Hooman attended University of Toronto for electrical engineering, and received his bachelor of commerce from Ryerson in Information Technology. For over 10 years, Hooman has been a leader in electronic manufacturing services helping clients from with various assemblies of PCBs and prototype designs.

BEST PRACTICES BGA/area array stencil aperture : Round or Square?

February 29, 2016Hooman Javdan

What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s. To find the answer we need to rephrase the...

Technical Notes Why do you get a bridge under BGA even though X-ray image is very clean

February 4, 2016Hooman Javdan

X-ray imaging is a very effective tool for detecting solder bridge under BGA’s. But why is it that in some instances an electrical short exists...

BEST PRACTICES No-load list

February 4, 2016Hooman Javdan

Inclusion of a no-load list in itlehe production package can play a significant role in ensuring an error free prototype assembly . This may...