Home
Services/Capabilities
Printed Circuit Board Assembly (PCBA)
PCB Prototyping and Quick Turn Assembly
Schematic and PCB Layout Design
Product Upgrade
Post Manufacturing Testing & Development
BGA Reballing and Repair Services
Solutions
Hardware Designers
New Product introduction (NPI)
Startups
Industries
Communications
Commercial
Industrial
Medical
Aerospace & Defence
Power & Renewable Energy
Blog
Contact Us
About Us
Terms & Conditions
Privacy Code
Standard Terms & Conditions of Sale
Site Map
1 (888) 568-6550
Blog
Home
Blog
Technical Notes
Characterization of BGA solder joints using X-ray...
March 7, 2016
Hooman Javdan
X-ray inspection is generally used to detect shorts under area array components.
Read More
Get Started
Back
