BGA Blogs

A BGA rework removes and replaces a ball grid array (BGA) device from a printed circuit board (PCB).

Ball grid array or BGA rework is one of the most challenging parts of printed circuit board (PCB) assembly and repair.

BGAs (Ball Grid Arrays) may initially seem difficult to solder because the solder balls are sandwiched between the BGA body and the circuit...

Before touching the BGA, a technician must do extensive research and make important decisions.

All of us have items that we use on a fairly regular basis. For example, most of us own cars that we drive reasonably frequently.

Those interested in BGA soldering may require help to rework their BGA.

BGA reballing involves changing every soldered ball on a grid array circuit.

To test for ball grid array (BGA) failure, you will need to use the dye and pry test method.