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Electronics manufacturing has many facets that cannot be taken for granted.

X-ray inspection is generally used to detect shorts under area array components.

What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s.

X-ray imaging is a very effective tool for detecting solder bridge under BGA’s.

Inclusion of a no-load list in itlehe production package can play a significant role in ensuring an error free prototype assembly   .