About The Author
Hooman Javdan

Hooman attended University of Toronto for electrical engineering, and received his bachelor of commerce from Ryerson in Information Technology. For over 10 years, Hooman has been a leader in electronic manufacturing services helping clients from with various assemblies of PCBs and prototype designs.

Keep These PCB Layout Considerations In Mind For Your Project

August 14, 2017

Printed circuit board layout plays an important role in the overall electromagnetic compatibility of any electronic system. PCBs that are laid out...

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Four Best Practices In Electronics Manufacturing

August 7, 2017

Electronics manufacturing has many facets that cannot be taken for granted. No matter what product...

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Characterization of BGA solder joints using X-ray imaging

March 7, 2016

X-ray inspection is generally used to detect shorts under area array components. But x-ray images can also provide a valuable insight into the...

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BGA/area array stencil aperture : Round or Square?

February 29, 2016

What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s. To find the answer we need to rephrase the...

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Why do you get a bridge under BGA even though X-ray image is very clean

February 4, 2016

X-ray imaging is a very effective tool for detecting solder bridge under BGA’s. But why is it that in some instances an electrical short exists...

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No-load list

February 4, 2016

Inclusion of a no-load list in itlehe production package can play a significant role in ensuring an error free prototype assembly   . This may...

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