Characterization of BGA solder joints using X-ray imaging
X-ray inspection is generally used to detect shorts under area array components. But x-ray images can also provide a valuable insight into the...
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BGA/area array stencil aperture : Round or Square?
What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s. To find the answer we need to rephrase the...
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Why do you get a bridge under BGA even though X-ray image is very clean
X-ray imaging is a very effective tool for detecting solder bridge under BGA’s. But why is it that in some instances an electrical short exists...
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No-load list
Inclusion of a no-load list in itlehe production package can play a significant role in ensuring an error free prototype assembly . This may...
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