Characterization of BGA solder joints using X-ray imaging
X-ray inspection is generally used to detect shorts under area array components. But x-ray images can also provide a valuable insight into the...
Read MoreBGA/area array stencil aperture : Round or Square?
What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s. To find the answer we need to rephrase the...
Read MoreWhy do you get a bridge under BGA even though X-ray image is very clean
X-ray imaging is a very effective tool for detecting solder bridge under BGA’s. But why is it that in some instances an electrical short exists...
Read MoreNo-load list
Inclusion of a no-load list in itlehe production package can play a significant role in ensuring an error free prototype assembly . This may...
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