X-ray inspection is generally used to detect shorts under area array components.
BGA/area array stencil aperture : Round or...
What is the best aperture geometry for depositing paste on round ball grid array pads on PCB’s.
Why do you get a bridge under BGA even though...
X-ray imaging is a very effective tool for detecting solder bridge under BGA’s.
No-load list
Inclusion of a no-load list in itlehe production package can play a significant role in ensuring an error free prototype assembly .